
WiredBusiness Named Media Partner of Food Packaging Summit USA 2027

WiredBusiness is pleased to be a media partner of Food Packaging Summit USA 2027.
Taking place on 22–23 February 2027 in Anaheim, California, the two-day conference will bring together senior leaders from across the US food-packaging value chain to examine how the industry can control costs, meet evolving compliance requirements and accelerate material innovation.
Connecting the food-packaging value chain
Food and beverage manufacturers will meet packaging suppliers, contract packagers, automation and equipment providers, and regulatory advisers. According to the organizer, the audience is designed around director-to-C-level decision-makers responsible for packaging design, procurement, food safety, compliance, sustainability and operations.
The summit's practical focus reflects the pressures now shaping packaging decisions: materials and production costs, regulatory change, traceability expectations, sustainability targets and the need to modernize operations without compromising food safety or performance.
What the programme covers
The programme will explore cost reduction, compliance frameworks and material shifts. Sessions are set to address PFAS-free reformulation, mono-material migration, digital traceability, automation and artificial intelligence, alongside technical results from suppliers and vendors and case studies showing smart packaging in practice.
The organizer says previous attendees have included representatives from Husky Technologies, ProAmpac, Dover Chemical Corporation and RecycleMe.
Event details
Event: Food Packaging Summit USA 2027
Dates: 22–23 February 2027
Location: Anaheim, California, USA
WiredBusiness readers can receive 20% off registration with code MP20. Visit the official Food Packaging Summit website to register and learn more.
WiredBusiness looks forward to supporting an exchange of practical insight across packaging, procurement, safety, compliance, sustainability and operations.



